DA Process Engineer(晶元粘贴工艺工程师)
DA Process Engineer(晶元粘贴工艺工程师)
面议
苏州工业园区 | 5年以上经验
发布时间:2022-09-26 23:30:01 | 截止时间:2022-09-30
基本信息:
  • 工艺工程师
  • 有经验要求
  • 全职
  • 1
职位描述及要求:
  • Job Requirement:
    1. Bachelor degree in engineering
    2. 5 years FOL Die Bond experience
    3. Be familiar with ASM equipment and familiar with QFN is preferred
    4. Good English communication and computer ability
    5. Normal Shift

    Job Description:
    1. Machine trouble shooting and failure analysis
    2. Process monitoring, analysis and improvement
    3. New material and process evaluation and development
    4. Generate SPEC include FMEA, control plan and checklist
    5. Cost and quality need to be continued improvement
岗位条件:
  • 本科
  • 英语熟练
  • 不限
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  • 外商独资、外企办事处
  • 电子技术/半导体/集成电路
  • 1000-1999
  • 苏州工业园区西沈浒路88号
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